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Serie KIOXIA BG4
SSD para clientes
SSD NVMe SSD M.2
La serie BG4 es una línea de único paquete compacto de unidades SSD NVMe™ con capacidad de hasta 1,024 GB que aprovecha la interfaz PCIe® 3.0 de 4 carriles y la memoria de TLC BiCS FLASH™ de 96 capas de KIOXIA. Con más ancho de banda, gestión flash perfeccionada y tecnología de búfer de memoria de host (HMB), las unidades SSD BG4 brindan el mejor rendimiento de lectura en unidades SSD de único paquete, que alcanza velocidades de lectura secuencial de 2,300 MB/s y genera 390,000 entradas/salidas por segundo (IOPS) de lectura aleatoria, con un consumo máximo activo de energía de 3.7 W (tipo).
La serie BG4 se encuentra disponible en cuatro modelos de capacidad de 128 GB, 256 GB, 512 GB y 1,024 GB en un único paquete de montaje superficial M.2 1620 o en un factor de forma de módulo extraíble M.2 2230, por lo que son adecuados para diseños de sistemas delgados y livianos de computadoras ultradelgadas, así como también para dispositivos incrustados y arranque de servidores en centros de datos.
La serie BG4 incluye la opción de un modelo de unidad con autocifrado (SED) compatible con Opal de TCG versión 2.01.
Documentos
Características
BiCS FLASH™ de 96 capas de KIOXIA
PCIe® 3.0 de 4 carriles, NVMe™
Capacidad de hasta1,024 GB
Único paquete M.2 1620 y factor de forma M.2 2230 de una cara
OPAL 2.01 de TCG opcional para SED
Aplicaciones principales
- Computadoras ultramóviles
- Computadoras portátiles 2 en 1
- Internet de las cosas(IoT)/dispositivos incrustados
- Unidades de arranque de matrices de servidores y almacenamiento
Especificaciones

* Table can be scrolled horizontally.
Base Model Number | KBG40ZPZ1T02 | KBG40ZPZ512G | KBG40ZPZ256G | KBG40ZPZ128G |
---|---|---|---|---|
Capacity | 1,024 GB | 512 GB | 256 GB | 128 GB |
Basic Specifications | ||||
Form Factor | M.2 1620-S3 Single package | M.2 1620-S2 Single package | ||
Connector Type | - | |||
lnterface | PCIe® Gen3 x4, NVMe™ 1.3b | |||
Maximum Interface Speed | 32 GT/s (Gen3 x4) | |||
Flash Memory Type | BiCS FLASH™ TLC | |||
Sequential Read | 2,300 MB/s | 2,200 MB/s | 2,000 MB/s | |
Sequential Write | 1,800 MB/s | 1,400 MB/s | 800 MB/s | |
Random Read | 390 K IOPS | 330 K IOPS | 200 K IOPS | |
Random Write | 200 K IOPS | 190 K IOPS | 150 K IOPS | |
Reliability | ||||
MTTF | 1,500,000 hours | |||
Power Requirements | ||||
Supply Voltage | 3.3 V ± 5 %, 1.8 V ±5 %,1.2 V ±5 % | |||
Power Consumption (Active) | 3.4 W typ. | 3.1 W typ. | 3.2 W typ. | 3 W typ. |
Power Consumption (L1.2 mode) | 5 mW typ. | |||
Dimensions | ||||
Height | 1.5 mm Max. | 1.3 mm Max. | ||
Width | 16.0 mm Max. | |||
length | 20.0 mm Max. | |||
Weight | 1.0 g Max. | 0.85 g Max. | ||
Environmental | ||||
Temperature (Operating) | 0 ~ 85 °C(TSMART) | |||
Temperature(Non-operating) | -40 ~ 85 °C | |||
Vibration (Operating/Non-operating) | - | |||
Shock (Operating/Non-operating) | - | |||
More features | ・Host Memory Buffer feature is supported. ・SLC cache is supported. ・Sanitize command is supported. |

* Table can be scrolled horizontally.
Base Model Number | KBG40ZNS1T02 | KBG40ZNS512G | KBG40ZNS256G | KBG40ZNS128G |
---|---|---|---|---|
Capacity | 1,024 GB | 512 GB | 256 GB | 128 GB |
Basic Specifications | ||||
Form Factor | M.2 2230-S3 Single-sided | M.2 2230-S2 Single-sided | ||
Connector Type | M.2 M | |||
lnterface | PCIe® Gen3 x4, NVMe™ 1.3b | |||
lnterface Speed | 32 GT/s (Gen3 x4) | |||
Flash Memory Type | BiCS FLASH™ TLC | |||
Sequential Read | 2,300 MB/s | 2,200 MB/s | 2,000 MB/s | |
Sequential Write | 1,800 MB/s | 1,400 MB/s | 800 MB/s | |
Random Read | 390 K IOPS | 330 K IOPS | 200 K IOPS | |
Random Write | 200 K IOPS | 190 K IOPS | 150 K IOPS | |
Reliability | ||||
MTTF | 1,500,000 hours | |||
Power Requirements | ||||
Supply Voltage | 3.3 V ± 5 % | |||
Power Consumption (Active) | 3.7 W typ. | 3.5 W typ. | 3.6 W typ. | 3.4 W typ. |
Power Consumption (L1.2 mode) | 5 mW typ. | |||
Dimensions | ||||
Height | 2.38 mm Max. | 2.23 mm Max. | ||
Width | 22.0 mm Max. | |||
length | 30.0 mm Max. | |||
Weight | 2.6 g Max. | 2.5 g Max. | ||
Environmental | ||||
Temperature (Operating) | 0 ~ 85 °C(TSMART) | |||
Temperature(Non-operating) | -40 ~ 85 °C | |||
Vibration (Operating/Non-operating) | 196 m/s2 { 20 G } ( Peak, 10 ~ 2,000 Hz ) | |||
Shock (Operating/Non-operating) | 14.7 km/s2 { 1,500 G } ( 0.5 ms ) | |||
More features | ・Host Memory Buffer feature is supported. ・SLC cache is supported. ・Sanitize command is supported. |
- Product image may represent a design model.
- Availability of the SED model line-up may vary by region.
- Definition of capacity: KIOXIA Corporation defines a megabyte (MB) as 1,000,000 bytes, a gigabyte (GB) as 1,000,000,000 bytes and a terabyte (TB) as 1,000,000,000,000 bytes. A computer operating system, however, reports storage capacity using powers of 2 for the definition of 1GB = 2^30 = 1,073,741,824 bytes and therefore shows less storage capacity. Available storage capacity (including examples of various media files) will vary based on file size, formatting, settings, software and operating system, such as Microsoft Operating System and/or pre-installed software applications, or media content. Actual formatted capacity may vary.
- 1 MB (megabyte) = 1,000,000 bytes.
- IOPS: Input Output Per Second (or the number of I/O operations per second).
- Read and write speed, tested on the state of "Host Memory Buffer (HMB) = On", may vary depending on the host device, read and write conditions, and file size.
- Read and write speed may vary depending on various factors such as host devices, software (drivers, OS etc.), and read/write conditions.
- MTTF (Mean Time to Failure) is not a guarantee or estimate of product life; it is a statistical value related to mean failure rates for a large number of products which may not accurately reflect actual operation. Actual operating life of the product may be different from the MTTF.
- TSMART : Composite Temperature in SMART/Health Information
- PCIe is a registered trademark of PCI-SIG.
- NVMe is a registered or unregistered mark of NVM Express, Inc. in the United States and other countries.
- Other company names, product names, and service names may be trademarks of their respective companies.
- All information provided here is subject to change without prior notice.
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