KIOXIA America Addresses the Future of Flash Storage in Hyperscale Data Centers at OCP Global Summit

New NVMe SSD Form Factors Take Center Stage

SAN JOSE, Calif., November 9, 2021 – Continuing its mission to positively impact today’s enterprise and hyperscale data centers, KIOXIA America, Inc. will be on hand this week at the 2021 OCP Global SummitAbra em uma nova showcase recent additions to its extensive data center and enterprise solid state drive (SSD) portfolio.  KIOXIA will highlight its Enterprise and Data Center Standard Form Factor (EDSFF) E3.S, CD7 Series PCIe® 5.0 SSDs as part of the industry’s first1 live demo of an E3.S drive. The company will also spotlight its EDSFF E1.S and Open Compute Platform (OCP) NVMe® Cloud SSD compliant XD6 Series Data Center SSDs. 

A hybrid event with in-person and virtual attendance options, the 2021 OCP Global Summit brings together a range of technology innovators focused on growing and supporting the open hardware ecosystem surrounding the data center.

Heralded as the NVMe SSD form factor of the future, EDSFF enables the next generation of SSDs to address future data center architectures, while supporting a variety of new devices and applications. KIOXIA is an active and contributing member to the industry development of EDSFF E1.S/L and E3.S/L solutions and is collaborating with leading data center, server and storage system developers to unlock the full power of flash memory, NVMe and PCIe technologies.

Demonstrations will be given in the KIOXIA booth #2A24 on the show floor at the San Jose McEnery Convention Center from November 9 – 10 and include:

  • KIOXIA CD7 Series: EDSFF E3.S SSDs designed with PCIe 5.0 technology, KIOXIA CD7 Series drives increase flash storage density per drive for optimized power efficiency and rack consolidation when compared to 2.5-inch form factor SSDs.
  • KIOXIA XD6 Series: XD6 Series EDSFF E1.S data center class SSDs were the first2 EDSFF E1.S SSDs to address the specific requirements of hyperscale applications, including the performance, power and thermal requirements of the OCP NVMe Cloud SSD Specification.
  • KumoScale™ Shared Accelerated Storage Software: Enabling networked NVMe flash at data center scale.

All demonstrations can also be accessed virtually by registering for OCP and visiting KIOXIA’s virtual platformAbra em uma nova janela..

OCP Leadership Session:

KIOXIA has been selected to present an Expo Hall speaking session at the conference. Titled, “TRIM Performance Optimizations and Metrics Used on KIOXIA Data Center SSDs Enabled Through the OCP Datacenter NVMe SSD Specification,” the session will be presented by Steven Wells, fellow, KIOXIA America, Inc., on November 10 at 1:50 PM PT. This session details how the OCP specification offers de-allocate guidance that allows OCP-enabled SSDs to realize performance gains.

“The Open Compute community is actively addressing the challenges of designing open hardware infrastructure that runs next-generation workloads within data centers,” noted Neville Ichhaporia, vice president, SSD marketing and product management, KIOXIA America, Inc.  “We are part of a community that is tackling these technology infrastructure challenges in a collaborative fashion and we believe that there are limitless opportunities to overcome these hurdles. At KIOXIA, we continue to do our part by innovating and adding to the broadest line of SSDs in the industry – all in support of the applications and services of the future.”

Registered OCP attendees choosing the virtual option are encouraged to view KIOXIA’s virtual platform liveAbra em uma nova janela.via the KIOXIA sponsor page. For more information, please visit

About KIOXIA America, Inc.
KIOXIA America, Inc. is the U.S.-based subsidiary of KIOXIA Corporation, a leading worldwide supplier of flash memory and solid-state drives (SSDs). From the invention of flash memory to today’s breakthrough BiCS FLASH™ 3D technology, KIOXIA continues to pioneer innovative memory, SSD and software solutions that enrich people's lives and expand society's horizons. The company's innovative 3D flash memory technology, BiCS FLASH, is shaping the future of storage in high-density applications, including advanced smartphones, PCs, SSDs, automotive, and data centers. For more information, please visit


1: Source: KIOXIA Corporation, as of November 9, 2021

2: Based on a survey of publicly available information as of November 3, 2020.

PCI Express and PCIe are registered trademarks of PCI-SIG.

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  • Information in this press release, including product pricing and specifications, content of services, and contact information is current and believed to be accurate on the date of the announcement, but is subject to change without prior notice. Technical and application information contained here is subject to the most recent applicable KIOXIA product specifications.