Imagem de BG7
Imagem de BG7 (M.2 Tipo 2230-S2)
Imagem de BG7 (M.2 Tipo 2242-S2)
Imagem de BG7 (M.2 Tipo 2280-S2)

SSD NVMe™ de cliente

A série KIOXIA BG7 é uma linha de SSDs NVMe™ de formato compacto com capacidades de até 2.048 GB, que utiliza uma interface compatível com as especificações PCIe® 4.0 e NVMe™ 2.0d, além da memória flash TLC KIOXIA BiCS FLASH™ de 8ª geração*. Com maior largura de banda, gerenciamento de memória flash aprimorado e tecnologia Host Memory Buffer (HMB), os SSDs da série BG7 oferecem desempenho de leitura muito alto para SSDs de formato compacto, de até 7.000 MB/s (leitura sequencial) e até 1.000K IOPS (leitura aleatória).

Os SSDs da série KIOXIA BG7 estão disponíveis em capacidades de 256 GB, 512 GB, 1.024 GB e 2.048 GB nos formatos de módulo M.2 Tipo 2230, Tipo 2242 e Tipo 2280, tornando-os adequados para designs de sistemas finos e leves, como PCs ultrafinos e PCs de IA. A série BG7 oferece uma opção de unidade de criptografia automática (SED), compatível com a versão 2.01 do TCG Opal.

  • KIOXIA BiCS FLASH™ memória flash TLC de 6ª geração para SSDs BG7 de 256 GB de capacidade Documentos

Documentos

Principais recursos

  • Memória flash TLC KIOXIA BiCS FLASH™ de 8ª geração (memória flash TLC KIOXIA BiCS FLASH™ de 6ª geração para 256 GB)
  • PCIe® 4.0 e NVMe™ 2.0d conforme as especificações
  • Capacidade de até 2.048 GB
  • Fatores de forma M.2 de um lado, tipos 2230, 2242 e 2280
  • Opção SED TCG OPAL 2.01

Principais aplicações

  • PCs ultra-móveis
  • PCs com IA
  • PCs notebook 2-em-1

* Table can be scrolled horizontally.

Base Model NumberKBG70ZNS2T04KBG70ZNS1T02KBG70ZNS512GKBG70ZNS256G
SED Model NumberKBG7BZNS2T04KBG7BZNS1T02KBG7BZNS512GKBG7BZNS256G
Capacity2,048 GB1,024 GB512 GB256 GB
Basic Specifications
Form FactorM.2 2230-S3 Single-sidedM.2 2230-S2 Single-sided
lnterfacePCIe® 4.0, NVMe™ 2.0d
Maximum Interface Speed64 GT/s (PCIe® Gen4 x4)
Flash Memory TypeBiCS FLASH™ TLC
Performance (Up to)
Sequential Read7,000 MB/s6,400 MB/s
Sequential Write6,000 MB/s5,000 MB/s4,000 MB/s
Random Read1,000 KIOPS850 KIOPS550 KIOPS500 KIOPS
Random Write1,000 KIOPS920 KIOPS850 KIOPS
Power Requirements
Supply Voltage3.3 V ± 5 %
Power Consumption (Active)4.5 W typ.
Power Consumption (L1.2 mode)3.0 mW typ.
Reliability
MTTF2,000,000 hours
TBW1,200600300150
Dimensions
Thickness2.38 mm Max2.23 mm Max
Width22 mm ± 0.15 mm
Length30 mm ± 0.15 mm
Weight3.2 g Max
Environmental
Temperature (Operating)0 ℃ to 85 ℃
Temperature (Non-operating)-40 ℃ to 85 ℃
Humidity (Operating)0 % to 90 % R.H.
Vibration (Operating)196 m/s2 { 20 Grms } ( 20 to 2,000 Hz )
Shock (Operating)14.7 km/s2 { 1,500 G } ( 0.5 ms )
M.2 tipo 2242-S2 / -S3 unilateral

* Table can be scrolled horizontally.

Base Model NumberKBG70ZNT2T04KBG70ZNT1T02KBG70ZNT512GKBG70ZNT256G
SED Model NumberKBG7BZNT2T04KBG7BZNT1T02KBG7BZNT512GKBG7BZNT256G
Capacity2,048 GB1,024 GB512 GB256 GB
Basic Specifications
Form FactorM.2 2242-S3 Single-sidedM.2 2242-S2 Single-sided
lnterfacePCIe® 4.0, NVMe™ 2.0d
Maximum Interface Speed64 GT/s (PCIe® Gen4 x4)
Flash Memory TypeBiCS FLASH™ TLC
Performance (Up to)
Sequential Read7,000 MB/s6,400 MB/s
Sequential Write6,000 MB/s5,000 MB/s4,000 MB/s
Random Read1,000 KIOPS850 KIOPS550 KIOPS500 KIOPS
Random Write1,000 KIOPS920 KIOPS850 KIOPS
Power Requirements
Supply Voltage3.3 V ± 5 %
Power Consumption (Active)4.5 W typ.
Power Consumption (L1.2 mode)3.0 mW typ.
Reliability
MTTF2,000,000 hours
TBW1,200600300150
Dimensions
Thickness2.38 mm Max2.23 mm Max
Width22 mm ± 0.15 mm
Length42 mm ± 0.15 mm
Weight3.8 g Max
Environmental
Temperature (Operating)0 ℃ to 85 ℃
Temperature (Non-operating)-40 ℃ to 85 ℃
Humidity (Operating)0 % to 90 % R.H.
Vibration (Operating)196 m/s2 { 20 Grms } ( 20 to 2,000 Hz )
Shock (Operating)14.7 km/s2 { 1,500 G } ( 0.5 ms )
M.2 tipo 2280-S2 / -S3 unilateral

* Table can be scrolled horizontally.

Base Model NumberKBG70ZNV2T04KBG70ZNV1T02KBG70ZNV512GKBG70ZNV256G
SED Model NumberKBG7BZNV2T04KBG7BZNV1T02KBG7BZNV512GKBG7BZNV256G
Capacity2,048 GB1,024 GB512 GB256 GB
Basic Specifications
Form FactorM.2 2280-S3 Single-sidedM.2 2280-S2 Single-sided
lnterfacePCIe® 4.0, NVMe™ 2.0d
Maximum Interface Speed64 GT/s (PCIe® Gen4 x4)
Flash Memory TypeBiCS FLASH™ TLC
Performance (Up to)
Sequential Read7,000 MB/s6,400 MB/s
Sequential Write6,000 MB/s5,000 MB/s4,000 MB/s
Random Read1,000 KIOPS850 KIOPS550 KIOPS500 KIOPS
Random Write1,000 KIOPS920 KIOPS850 KIOPS
Power Requirements
Supply Voltage3.3 V ± 5 %
Power Consumption (Active)4.5 W typ.
Power Consumption (L1.2 mode)3.0 mW typ.
Reliability
MTTF2,000,000 hours
TBW1,200600300150
Dimensions
Thickness2.38 mm Max2.23 mm Max
Width22 mm ± 0.15 mm
Length80 mm ± 0.15 mm
Weight6.3 g Max
Environmental
Temperature (Operating)0 ℃ to 85 ℃
Temperature (Non-operating)-40 ℃ to 85 ℃
Humidity (Operating)0 % to 90 % R.H.
Vibration (Operating)196 m/s2 { 20 Grms } ( 20 to 2,000 Hz )
Shock (Operating)14.7 km/s2 { 1,500 G } ( 0.5 ms )
  • Product image may represent a design model.
  • Availability of the SED model line-up may vary by region.
  • Definition of capacity: KIOXIA Corporation defines a megabyte (MB) as 1,000,000 bytes, a gigabyte (GB) as 1,000,000,000 bytes and a terabyte (TB) as 1,000,000,000,000 bytes. A computer operating system, however, reports storage capacity using powers of 2 for the definition of 1 GB = 2^30 = 1,073,741,824 bytes and therefore shows less storage capacity. Available storage capacity (including examples of various media files) will vary based on file size, formatting, settings, software and operating system, such as Microsoft Operating System and/or pre-installed software applications, or media content. Actual formatted capacity may vary.
  • IOPS: Input Output Per Second (or the number of I/O operations per second).
  • TBW: Terabytes Written. The number of terabytes that may be written to the SSD for the specified lifetime.
  • Read and write speed, tested on the state of "Host Memory Buffer (HMB) = On", may vary depending on the host device, read and write conditions, and file size.
  • Read and write speed may vary depending on various factors such as host devices, software (drivers, OS etc.), and read/write conditions.
  • MTTF (Mean Time to Failure) is not a guarantee or estimate of product life; it is a statistical value related to mean failure rates for a large number of products which may not accurately reflect actual operation. Actual operating life of the product may be different from the MTTF.
  • PCIe is a registered trademark of PCI-SIG.
  • NVMe is a registered or unregistered mark of NVM Express, Inc. in the United States and other countries.
  • Other company names, product names, and service names may be trademarks of third-party companies.
  • All information provided here is subject to change without prior notice.

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