SSD Cliente
SSD M.2 NVMe.

A série XG6 utiliza a mais recente memória flash de 96 camadas, 3D TLC (3-bit-per-cell) da KIOXIA. Com recursos de cache BiCS FLASH™ e SLC de 4ª geração, os SSDs XG6 alcançam velocidades de leitura/gravação sequenciais de 3180 MB/s e 2960 MB/s, respectivamente, e entregam IOPS de leitura aleatória até 355.000 e gravação aleatória de 365.000. Além do alto desempenho, o XG6 possui o design de baixa potência da família XG, consumindo 4,7 W ou menos no modo ativo e menos de 3 mW no modo de espera.

A nova série XG6 é otimizada para computadores móveis sensíveis à energia, computadores de jogos orientados ao desempenho, bem como ambientes de data center para inicialização, armazenamento em cache e registro de servidores.
Disponível em formato compacto M.2 2280, a série XG6 vem em três modelos de capacidade de 256 GB, 512 GB e 1.024 GB, cada um com a opção de um modelo de unidade Self-Encrypting (SED) que suporta a versão TCG Opal 2.01.

Documentos

Principais recursos

BiCS FLASH™ de 96 camadas da KIOXIA

PCIe® Gen3 x4 de 96 camadas da KIOXIA, NVMe™

Capacidade de até 1.024 GB

M.2 2280 (de lado único)

TCG OPAL 2.01 opcional para SED

Principais aplicações

  • Computador notebook de alto desempenho
  • Computador de mesa de alto desempenho
  • Computador para jogos
  • Servidor de arranque, cache e registro de uso no data center

Especificações

* Table can be scrolled horizontally.

Model Number(Non-SED)KXG60ZNV1T02KXG60ZNV512GKXG60ZNV256G
Model Number(SED)KXG6AZNV1T02KXG6AZNV512GKXG6AZNV256G
Capacity1,024 GB512 GB256 GB
Basic Specifications
Form FactorM.2 2280-S2 Single-sided
Connector TypeM.2 M
lnterfacePCIe® Gen3 x4, NVMe™ 1.3a
lnterface Speed32 GT/s (Gen3 x4)
Flash Memory TypeBiCS FLASH™ TLC
Sequential Read3,180 MB/s3,100 MB/s3,050 MB/s
Sequential Write2,960 MB/s2,800 MB/s1,550 MB/s
Power Requirements
Supply Voltage3.3 V ± 5 %
Power Consumption (Active)4.7 W typ.4.1 W typ.4 W typ.
Power Consumption (L1.2 mode)3 mW typ.
Reliability
MTTF1,500,000 hours
Dimensions
Height2.23 mm
Width22.0 mm
length80.0 mm typ.
Weight7.3 g typ.7.0 g typ.
Environmental
Temperature (Operating)0 ~ 95 °C (Controller Temperature)
Temperature (Operating)0 ~ 85 °C (Other Components Temperature)
Temperature(Non-operating)-40 ~ 85 °C
Vibration (Operating/Non-operating)196 m/s2 { 20 G } ( Peak, 10 ~ 2,000 Hz )
Shock (Operating/Non-operating)14.7 km/s2 { 1,500 G } ( 0.5 ms )
More features・Sanitize command is supported.
・Namespace Management and Namespace Attachment commands are supported.
・Non-Operational Power State Configuration is supported.
・TCG Storage Interface Interactions Specification (SIIS) Version 1.07 is supported.
  • Product image may represent a design model.
  • Availability of the SED model line-up may vary by region.
  • Definition of capacity: KIOXIA Corporation defines a megabyte (MB) as 1,000,000 bytes, a gigabyte (GB) as 1,000,000,000 bytes and a terabyte (TB) as 1,000,000,000,000 bytes. A computer operating system, however, reports storage capacity using powers of 2 for the definition of 1GB = 2^30 = 1,073,741,824 bytes and therefore shows less storage capacity. Available storage capacity (including examples of various media files) will vary based on file size, formatting, settings, software and operating system, such as Microsoft Operating System and/or pre-installed software applications, or media content. Actual formatted capacity may vary.
  • MTTF (Mean Time to Failure) is not a guarantee or estimate of product life; it is a statistical value related to mean failure rates for a large number of products which may not accurately reflect actual operation. Actual operating life of the product may be different from the MTTF.
  • Read and write speed, tested on the state of "SLC cache=ON", may vary depending on the host device, read and write conditions, and file size.
  • PCIe is a registered trademark of PCI-SIG.
  • NVMe is a registered or unregistered mark of NVM Express, Inc. in the United States and other countries.
  • Other company names, product names, and service names may be trademarks of their respective companies.

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