Toshiba Memory America Addresses Transformation of Cloud Storage Architectures at OCP Global Summit 2019

NVMe-oF Leader to Highlight Latest Version of its KumoScale Software; Lead Session on Benefits of Disaggregated, Shared Storage Model

SAN JOSE, Calif., March 14, 2019 – This week at the 2019 Open Compute Project (OCP) Global Summit, Toshiba Memory America, Inc., the U.S.-based subsidiary of Toshiba Memory Corporation, will be on the show floor highlighting a wide array of solutions targeted to the needs of hyperscale data center operators. Toshiba Memory’s proof of concept native Ethernet NVMe-oF™ (NVM Express™ over Fabrics) SSDs, data center optimized PCIe®, SAS, and SATA SSDs, and KumoScale™ NVMe-oF shared accelerated storage software can all be seen at Toshiba Memory’s booth #A1 in the San Jose Convention Center from March 14 – 15.

As scale-out workloads are deployed at massive scale, the high throughput, low latency and resilience of NVMe™ delivers a notable advantage. Cloud storage architectures are in a transition phase, and ecosystem support for NVMe-oF, and the increased flexibility and efficiency it brings, is growing. In fact, according to G2M Research, the current footprint for NVMe-enabled systems and devices is expected to grow exponentially by 2020 – becoming a multi-billion dollar market1.

Accelerating Technology at the Speed of Flash
A leading provider of NVMe SSDs, technology and software, Toshiba Memory is committed to helping cloud data center customers maximize flash and compute resources. The company’s KumoScale software is a key NVMe-oF enabler for disaggregated storage cloud deployments. First introduced last year, Toshiba Memory has recently enhanced KumoScale’s capabilities. KumoScale’s version 3.9 production release includes general availability support for TCP-based networks. Toshiba Memory will provide demos of the improved software at the OCP Global Summit, taking place March 14 – 15, 2019, in San Jose, California.

Other Toshiba Memory exhibits include:

  • Extensive lineup of SSDs optimized for the data center
  • Native Ethernet NVMe-oF SSDs

Additionally, Joel Dedrick, vice president and general manager of KumoScale Shared and Accelerated Storage for Toshiba Memory, will speak to the technical and financial benefits that implementers of private cloud solutions can achieve with the disaggregated shared storage model enabled by KumoScale software. The speaking session will take place on the show floor on Friday, March 15 at 2:30 p.m. PDT.

“OCP offers the ideal venue for the industry’s best and brightest to gather and address the challenges of designing open hardware infrastructure that runs next-generation workloads within data centers,” noted Neville Ichhaporia, senior director of data center SSD marketing for  Toshiba Memory America Inc. “We are excited to be part of a community that is actively addressing these challenges in a collaborative fashion – as we all share the same goal: accelerating adoption of the latest technologies that will power the next wave of applications and services.”

1 Source: G2M Research NVMe Market Forecast & Vendor Report Abstract
NVMe, NVM Express, and NVMe-oF are trademarks of NVM Express, Inc.
PCIe is a registered trademark of PCI-SIG.
All company names, product names and service names may be trademarks of their respective companies.;

About Toshiba Memory America, Inc.
Toshiba Memory America, Inc. is the U.S.-based subsidiary of Toshiba Memory Corporation, a leading worldwide supplier of flash memory and solid state drives (SSDs).  From the invention of flash memory to today’s breakthrough 96-layer BiCS FLASH™ TLC (3-bit-per-cell) 3D flash memory technology, Toshiba continues to lead innovation and move the industry forward.  For more information on Toshiba Memory, please visit and follow us on social media.

  • Information in this press release, including product pricing and specifications, content of services, and contact information is current and believed to be accurate on the date of the announcement, but is subject to change without prior notice. Technical and application information contained here is subject to the most recent applicable Toshiba product specifications.