KIOXIA First to Introduce JEDEC XFM Removable Storage Device Compliant with Ver.1.0 PCIe/NVMe Specification

SAN JOSE, Calif., June 14, 2022 – KIOXIA America, Inc. today announced sampling of the industry’s first1 XFM DEVICE Ver.1.0-compliant removable PCIe^® standard attached, NVMe^® storage device: the XFMEXPRESS™ XT2. With a new form factor and connector, the XFM DEVICE Ver.1.0 standard delivers an unparalleled combination of features designed to revolutionize ultra-mobile PCs, IoT devices and a variety of embedded applications.  

First introduced in August of 2019, and then presented as a proposal to the JEDEC Subcommittee for Electrical Specifications and Command Protocols, KIOXIA XFMEXPRESS XT2 is a new form factor for PCIe/NVMe specification devices. Featuring a powerful combination of small size, speed and serviceability, XFMEXPRESS technology was developed to enhance next-generation mobile and embedded applications. The XFMEXPRESS XT2 from KIOXIA is the first product to meet the specification of the new JEDEC standard.

Recognizing the need for a new class of removable storage, KIOXIA leveraged its extensive background in single package memory designs to develop the XFMEXPRESS XT2. KIOXIA will demonstrate its XFMEXPRESS XT2 solution live at Interop Tokyo 2022 in Makuhari Messe, Japan, from June 15-17 in Hall 5 booth # 5P15. The same demonstration will be given at Embedded World 2022 in Nurnberg, Germany from June 21-23 in Hall 3A booth #3A-117. KIOXIA will also be on hand to demonstrate the new XFMEXPRESS XT2 at the Flash Memory Summit 2022 from August 2-4 at the Santa Clara Convention Center.

KIOXIA XFMEXPRESS XT2 Key Features and Benefits:
 

• Game-Changing Serviceability
  The XFMEXPRESS XT2 enables a new category of small storage devices that are easy to service or upgrade. By pairing a robust, compact package with removable storage functionality and flexibility, the XFMEXPRESS XT2 helps diminish technical barriers and design constraints.
• Mobile-Friendly Footprint
  The JEDEC XFM DEVICE Ver.1.0 form factor’s small size and low profile (14mm x 18mm x 1.4mm) offers a 252㎟ footprint, optimizing the mounting space for ultra-compact host devices without sacrificing performance or serviceability.  With this minimized z-height, the XFMEXPRESS XT2’s form factor is excellent for thin and light notebooks and creates new design possibilities for next generation applications and systems.
• Interface
  Designed for speed, the XFMEXPRESS XT2 implements a PCIe 4.0 x 2 lanes, NVMe 1.4b interface. The XFMEXPRESS XT2’s industry-leading³ performance capabilities and durable form factor provide a compelling alternative to other SSD form factors (such as M.2), enabling superior computing and entertainment experiences.
   

“Our award-winning KIOXIA XFMEXPRESS technology is redefining flash storage to enable the thinner, smaller, serviceable form factors of the future,” noted Brian Kumagai, director of business development for KIOXIA America, Inc.  “As the inventors of flash memory, KIOXIA will continue to innovate and lead the way forward with breakthrough storage solutions that solve complex design challenges.”

For more information, visit americas.kioxia.com.

About KIOXIA America, Inc.  
KIOXIA America, Inc. is the U.S.-based subsidiary of KIOXIA Corporation, a leading worldwide supplier of flash memory and solid state drives (SSDs). From the invention of flash memory to today’s breakthrough BiCS FLASH™ 3D technology, KIOXIA continues to pioneer innovative memory, SSD and software solutions that enrich people's lives and expand society's horizons. The company's innovative 3D flash memory technology, BiCS FLASH, is shaping the future of storage in high-density applications, including advanced smartphones, PCs, SSDs, automotive, and data centers. For more information, please visit americas.kioxia.com.