KIOXIA Spotlights Flash Solutions Shaping the Future of Storage at FMS 2024

SAN JOSE, Calif., August 5, 2024 – KIOXIA will be at FMS: the Future of Memory and Storage this week to highlight how its breakthrough flash memory solutions are driving advancements and improvements in hundreds of applications across a wide range of market segments – from AI, IoT, and automotive to data centers, the cloud and the edge. Key highlights will include the industry’s highest capacity¹ 2Tb QLC flash memory featuring the latest BiCS FLASH™ 3D flash memory as well as NVMe™ SSDs enabling AI workloads and KIOXIA RAID Offload technology.

KIOXIA invented flash memory more than 35 years ago, and is committed to making memory solutions that enable the applications of tomorrow. Prior to the show this week, KIOXIA was recognized by FMS with the Lifetime Achievement Award for 2024. The company’s engineering team was honored with this prestigious award for its pioneering work creating and commercializing 3D flash memory – a breakthrough technology that has become fundamental to every flash memory-based product today. The award presentation will take place on Tuesday, Aug 6^th at 11:30am as part of the opening keynotes.

"Flash storage solutions from KIOXIA are at the heart of countless applications, driving innovation across a diverse array of industries," said Scott Nelson, executive vice president and chief marketing officer for KIOXIA America, Inc. "Our advanced memory solutions are integral to the functionality and advancement of modern technology. Whether you're looking to upgrade, create, or innovate, you can make it with KIOXIA. We unlock new possibilities and turn visions into realities."

At FMS, KIOXIA will give a keynote presentation and several educational sessions covering a range of topics:

FMS Keynote Presentation:
“Memory Innovations Fueling the New Currency of Our Digital World”
Tuesday, August 6 at 11 a.m. PDT
Atsushi Inoue, vice president and technology executive for KIOXIA Corporation’s Memory Division, and Neville Ichhaporia, senior vice president and general manager of the SSD business unit for KIOXIA America, Inc. will present this keynote session.

Executive AI Premier Level Panel:
“Storage and Memory Innovation for AI Workloads”
Thursday, August 8 at 11 a.m. PDT
Rory Bolt, senior fellow and principal architect, SSD Business Unit for KIOXIA America Inc., will participate in an executive session, hosted and moderated by NVIDIA, that assembles a panel of experts from across the storage and memory industry to provide insights into solutions for different AI applications.  

Special AI Panel:
“Emerging Technologies for AI Chip and Generative AI Optimization”
Thursday, August 8 at 1:30 p.m. PDT
Led by an industry analyst, Rory Bolt will join other invited speakers from influential processor, memory and generative AI companies to discuss the hardware and software technologies driving the future of AI chips and generative AI customer implementations.

Educational Sessions by KIOXIA:
SSD Technology Track
Tuesday, 8/6, 9:45-10:50am
SSDT-102-1: SSD Technologies for Compute Use Cases
Speaker: Devesh Rai

• Review of RAID Offload Concept
   

Tuesday, 8/6, 9:45-10:50am
SSDT-102-1: SSD Technologies for Compute Use Cases
Speaker: Nick Snow

• PCIe^® 6.0 SSDs: Powering the Future of Compute and Storage
   

Thursday, 8/8, 1:25-2:30pm
SSDT-304-1: New Form Factors and Interfaces for SSDs
Speaker: Ilya Cherkasov

• New Form Factors and Interfaces for SSDs
   

Flash Architectures Track
Tuesday, 8/6, 8:30-9:45am
FARP-101-1: FDP and ZNS
Speaker: Rory Bolt

• Flexible Data Placement (FDP): What Every Storage Architect Should
  Know
   

Sustainability Track
Wednesday, 8/7, 9:45-10:50am
SUST-202-1: Sustainable Data Centers and Energy Efficiency
Speaker: Satvik Vyas

• Achieve Significant Reduction in Data Movement by Offloading Data Scrubbing
   

CXL^® Track
Thursday, 8/8, 8:30-9:35am
CXLT-301-1:
Speaker:  Mahinder Saluja

• TCO Use Cases for CXL Attached Flash Memory
   

Networks and Connections Track
Thursday, 8/8, 9:45-10:50am
NETC-302-1: NVMe over Fabrics^® Is Everywhere
Speaker:  Mahinder Saluja

• Redefining Data Redundancy with RAID Offload
   

AI/ML Track
Wednesday, 8/7, 3:10-4:15pm
AIML-203-1: Generative AI
Speaker:  Assaf Sella

• Flash is Driving Scale in RAG-based LLMs
   

SuperWomen in Flash Track
Wednesday, 8/7, 4:00-6:15pm
Evolution Courtyard, Floor 1
Speaker:  Jenna Fong

• Celebrating the success of women in the industry
   

KIOXIA Booth Demos
Product and technology demonstrations will be given in the iconic 2-level KIOXIA booth #307 - featuring eight separate exhibit locations - on the show floor including:
 

• Next Generation KIOXIA BiCS FLASH™ 3D Flash Memory: Display showing CMOS Bonded Array (CBA) architecture and a lateral density model.
• KIOXIA CM7 Series E3.S Enterprise NVMe SSDs: Live demo running a BaM workload and highlighting the EDSFF form factor.
• KIOXIA Optical NVMe SSD Technology: Featuring CM7 Series Enterprise NVMe SSDs.
• KIOXIA CD8P Series Data Center SSDs: Live demo running AiSAQ ANN search for AI.
• KIOXIA CXL Solutions: Featuring BiCS FLASH™ 3D flash memory and XL-FLASH high-bandwidth, low-latency CXL solutions.
• KIOXIA RAID Offload Technology: Move RAID functionality to SSDs.
• KIOXIA Automotive UFS: Driving the future of automotive applications.
• KIOXIA XD7P Series E1.S Data Center SSDs: Demo of Live Migration.

For more information, please visit www.kioxia.com, and follow the company on X, formerly known as Twitter and LinkedIn^®.  

About KIOXIA America, Inc.

KIOXIA America, Inc. is the U.S.-based subsidiary of KIOXIA Corporation, a leading worldwide supplier of flash memory and solid-state drives (SSDs). From the invention of flash memory to today’s breakthrough BiCS FLASH™ 3D technology, KIOXIA continues to pioneer innovative memory, SSD and software solutions that enrich people's lives and expand society's horizons. The company's innovative 3D flash memory technology, BiCS FLASH, is shaping the future of storage in high-density applications, including advanced smartphones, PCs, SSDs, automotive, and data centers. For more information, please visit KIOXIA.com.

© 2024 KIOXIA America, Inc. All rights reserved. Information in this press release, including product pricing and specifications, content of services, and contact information is current and believed to be accurate on the date of the announcement, but is subject to change without prior notice. Technical and application information contained here is subject to the most recent applicable KIOXIA product specifications.

Notes:

1: Source: As of July 3, 2024. KIOXIA survey.

In every mention of a KIOXIA product: Product density is identified based on the density of memory chip(s) within the Product, not the amount of memory capacity available for data storage by the end user. Consumer-usable capacity will be less due to overhead data areas, formatting, bad blocks, and other constraints, and may also vary based on the host device and application. For details, please refer to applicable product specifications. The definition of 1KB = 2¹⁰ bytes = 1,024 bytes. The definition of 1Gb = 2³⁰ bits = 1,073,741,824 bits. The definition of 1GB = 2³⁰ bytes = 1,073,741,824 bytes.  1Tb = 2⁴⁰ bits = 1,099,511,627,776 bits.

The NVMe word mark is a registered or unregistered trademark or service mark of NVM Express, Inc. in the United States and other countries. Unauthorized use strictly prohibited.

Universal Flash Storage (UFS) is a product category for a class of embedded memory products built to the JEDEC UFS standard specification. JEDEC is a registered trademark of JEDEC Solid State Technology Association.

PCIe is a registered trademark of PCI-SIG.

CXL is a registered trademark of the Compute Express Link Consortium, Inc

LinkedIn is a trademark of LinkedIn Corporation and its affiliates in the United States and/or other countries.

All other company names, product names and service names may be trademarks of their respective companies.

Information in this press release, including product pricing and specifications, content of services, and contact information is current and believed to be accurate on the date of the announcement, but is subject to change without prior notice. Technical and application information contained here is subject to the most recent applicable KIOXIA product specifications.