Imagem de xg8_001

SSD NVMe™ de cliente

A série XG6 utiliza a mais recente memória flash de 112 camadas, 3D TLC (3-bit-per-cell) da KIOXIA. Com recursos de cache BiCS FLASH ™ e SLC de 5ª geração, os SSDs XG8 alcançam velocidades de leitura/gravação sequenciais de 7.000 MB/s e 5.800 MB/s, respectivamente, e entregam IOPS de leitura aleatória até 620.000 e gravação aleatória de 620.000. O consumo de energia da série XG8 é de 8,1 W ou menos no modo ativo e inferior a 3 mW no modo de espera.

A nova série XG6 é otimizada para computadores móveis sensíveis à energia, computadores de jogos orientados ao desempenho, bem como ambientes de data center para inicialização, armazenamento em cache e registro de servidores.

Disponível em formato compacto M.2 2280, a série XG6 vem em três modelos de capacidade de 512 GB, 1.024 GB, 2.048 GB e 4.096 GB cada um com a opção de um modelo de unidade Self-Encrypting (SED) que suporta a versão TCG Opal 2.01.

Documentos

Principais recursos

  • BiCS FLASH™ de 112 camadas da KIOXIA
  • PCIe® 4.0, NVMe™ 1.4
  • Capacidade de até 2.048 GB
  • M.2 tipo 2280 unilateral (512 GB, 1.024 GB, 2.048 GB)/dupla face (4.096 GB)
  • TCG OPAL 2.01 opcional para SED

Principais aplicações

  • Computador notebook de alto desempenho
  • Computador de mesa de alto desempenho
  • Computador para jogos
  • Servidor de arranque, cache e registro de uso no data center

Especificações

* Table can be scrolled horizontally.

Base Model NumberKXG80ZN84T09KXG80ZNV2T04KXG80ZNV1T02KXG80ZNV512G
SED Model NumberKXG8AZN84T09KXG8AZNV2T04KXG8AZNV1T02KXG8AZNV512G
Capacity4,096 GB2,048 GB1,024 GB512 GB
Basic Specifications
Form FactorM.2 2280-D2 Double-sidedM.2 2280-S2 Single-sided
lnterfacePCIe® 4.0, NVMe™ 1.4
Maximum Interface Speed64 GT/s (PCIe® Gen4 x4)
Flash Memory TypeBiCS FLASH™ TLC
Performance (Up to)
Sequential Read7,000 MB/s
Sequential Write5,800 MB/s5,600 MB/s5,000 MB/s
Random Read900K IOPS750K IOPS
Random Write620K IOPS600K IOPS
Power Requirements
Supply Voltage3.3 V ± 5 %
Power Consumption (Active)8.1 W typ.7.7 W typ.
Power Consumption (L1.2 mode)3.0 mW typ.
Reliability
MTTF1,500,000 hours
TBW2,4001,200600300
Dimensions
Thickness3.58 mm Max2.23 mm Max
Width22.0 mm ± 0.15 mm
Length80.0 mm ± 0.15 mm
Weight8.3 g Max7.1 g Max6.8 g Max6.6 g Max
Environmental
Temperature (Operating)0 ℃ to 95 ℃ (Controller Temperature)
Temperature (Operating)0 ℃ to 85 ℃ (Other Components Temperature)
Temperature (Non-operating)-40 ℃ to 85 ℃
Humidity (Operating)0 % to 90 % R.H.
Vibration (Operating)196 m/s2 { 20 Grms } ( 20 Hz to 2,000 Hz )
Shock (Operating)14.7 km/s2 { 1,500 G } ( 0.5 ms )
  • Product image may represent a design model.
  • Availability of the SED model line-up may vary by region.
  • Definition of capacity: KIOXIA Corporation defines a megabyte (MB) as 1,000,000 bytes, a gigabyte (GB) as 1,000,000,000 bytes and a terabyte (TB) as 1,000,000,000,000 bytes. A computer operating system, however, reports storage capacity using powers of 2 for the definition of 1 GB = 2^30 = 1,073,741,824 bytes and therefore shows less storage capacity. Available storage capacity (including examples of various media files) will vary based on file size, formatting, settings, software and operating system, and/or pre-installed software applications, or media content. Actual formatted capacity may vary.
  • MTTF (Mean Time to Failure) is not a guarantee or estimate of product life; it is a statistical value related to mean failure rates for a large number of products which may not accurately reflect actual operation. Actual operating life of the product may be different from the MTTF.
  • TBW: Terabytes Written. The number of terabytes that may be written to the SSD for the specified lifetime.
  • Read and write speed, tested on the state of "SLC cache=ON", may vary depending on the host device, read and write conditions, and file size.
  • PCIe is a registered trademark of PCI-SIG.
  • NVMe is a registered or unregistered mark of NVM Express, Inc. in the United States and other countries.
  • Other company names, product names, and service names may be trademarks of third-party companies.

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