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SSDs Data Center NVMeTM SSDs

Os SSDs KIOXIA XD7P Series E1.S são projetados para a especificação Enterprise and Datacenter Standard Form Factor (EDSFF) E1.S para atender aos requisitos específicos de aplicativos de hiperescala, incluindo os requisitos de desempenho, energia e calor da especificação SSD em nuvem NVMe™ Open Compute Platform (OCP). Além do E1.S de 9,5 mm de espessura, o E1.S de 15 mm de espessura com o dissipador de calor também é suportado. Projetados para otimizar a densidade e a eficiência do sistema, os SSDs da série XD7P representam o futuro do armazenamento flash para servidores e sistemas de armazenamento em data centers em nuvem e em hiperescala e suportam capacidades de armazenamento de até 7,68 TB.


Principais recursos

  • Compatível com PCIe® 5.0, especificações da NVMe™ 2.0
  • Suporte a especificação v2.0 do Open Compute Project Datacenter NVMe™ SSD (nem todos os requisitos)
  • Fator de forma E1.S (9,5 mm / 15 mm de espessura)
  • Arquitetura própria da KIOXIA: controlador, firmware e memória flash 3D BiCS FLASH™
  • Opções de capacidade de 1,92 TB / 3,84 TB / 7,68 TB
  • Proteção contra perda de energia (PLP) e proteção de dados de ponta a ponta
  • Opções de segurança: Unidade de auto-criptografia (SED)

Principais aplicações

  • Servidores e sistemas de armazenamento em nuvem e data centers em hiperescala.


* Table can be scrolled horizontally.

Capacity7,680 GB3,840 GB1,920 GB7,680 GB3,840 GB1,920 GB
Basic Specifications
Form FactorE1.S 15mmE1.S 9.5mm
lnterfacePCIe® 5.0, NVMe™ 2.0
Maximum Interface Speed64 GT/s (PCIe® Gen4 x4)
Flash Memory TypeBiCS FLASH™ TLC
Performance (Up to)
Sustained 128 KiB Sequential Read7,200 MB/s
Sustained 128 KiB Sequential Write4,800 MB/s3,100 MB/s4,800 MB/s3,100 MB/s
Sustained 4 KiB Random Read1,550K IOPS1,650K IOPS1,500K IOPS1,550K IOPS1,650K IOPS1,500K IOPS
Sustained 4 KiB Random Write200K IOPS180K IOPS95K IOPS200K IOPS180K IOPS95K IOPS
Power Requirements
Supply Voltage12 V ± 10 %
Power Consumption (Active)20 W typ.16 W typ.20 W typ.16 W typ.
Power Consumption (Ready)5 W typ.
MTTF2,000,000 hours
Thickness15 mm ± 0.35 mm9.5 mm ± 0.35 mm
Width33.75 mm ± 0.25 mm
Length118.75 mm ± 0.55 mm
Weight90 g Max75 g Max
Temperature (Operating)0 °C to 75 °C
Temperature (Non-operating)-40 °C to 85 °C
Humidity (Operating)5 % to 95 % R.H.
Vibration (Operating)12 m/s2 { 1.24 Grms } ( 2 to 500 Hz )
Shock (Operating)6,864 m/s2 { 700 G } ( 0.5 ms )
  • Product image may represent a design model.
  • Definition of capacity: KIOXIA Corporation defines a megabyte (MB) as 1,000,000 bytes, a gigabyte (GB) as 1,000,000,000 bytes and a terabyte (TB) as 1,000,000,000,000 bytes. A computer operating system, however, reports storage capacity using powers of 2 for the definition of 1 GB = 2^30 = 1,073,741,824 bytes and therefore shows less storage capacity. Available storage capacity (including examples of various media files) will vary based on file size, formatting, settings, software and operating system, and/or pre-installed software applications, or media content. Actual formatted capacity may vary.
  • GT/s: Giga Transfers per second.
  • A kibibyte (KiB) means 2^10, or 1,024 bytes.
  • MTTF (Mean Time to Failure) is not a guarantee or estimate of product life; it is a statistical value related to mean failure rates for a large number of products which may not accurately reflect actual operation. Actual operating life of the product may be different from the MTTF.
  • DWPD: Drive Writes Per Day. One full drive write per day means the drive can be written and re-written to full capacity once a day every day for the specified lifetime. Actual results may vary due to system configuration, usage and other factors.
  • Read and write speed may vary depending on various factors such as host devices, software (drivers, OS etc.), and read/write conditions.
  • IOPS: Input Output Per Second (or the number of I/O operations per second).
  • Temperature (operating): Specified by the composite temperature reported by SMART.
  • SED optional model supports TCG Opal SSC except for some features. For more details, please make inquiries through “Contact us”.
  • SED optional model is not available in all countries due to the local regulations.
  • All information provided here is subject to change without prior notice.
  • PCIe is a registered trademark of PCI-SIG.
  • NVMe is a registered or unregistered mark of NVM Express, Inc. in the United States and other countries.
  • Other company names, product names, and service names may be trademarks of third-party companies.



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