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EDSFF E3 Form Factor
E3 - Enterprise Servers and Storage
| Type | Thickness (mm) | Width (mm) | Length (mm) | Max Power (W) |
|---|---|---|---|---|
| E3.S | 7.5 | 76 | 112.75 | 25 |
| E3.S 2T | 16.8 | 40 | ||
| E3.L | 7.5 | 142.2 | ||
| E3.L 2T | 16.8 | 70 |
PCIe® Lanes per Connector
E3 Max Power
Engineering Specifications from SNIA
| E3 Mechanical/Electrical Specification | SFF-TA-1008 |
| E3 Thermal Characterization Specification | SFF-TA-1023 |
| EDSFF Connector Specification | SFF-TA-1002 |
| EDSFF Connector Pinout (PCIe) | SFF-TA-1009 |
KIOXIA EDSFF E3 Offerings
KIOXIA CD9P Series
KIOXIA CM9 Series
Systems Supporting EDSFF E3.S Form Factor SSDs
While E3 form factors began with a focus on traditional enterprise server and storage use cases, hyperscalers are evaluating E3 for use in scale-out environments. Many server, storage and SSD companies with 2.5-inch storage solutions are aligned with the E3 Family. Initial development and demonstration systems in support of the E3 Family of form factors are well underway with early full function development vehicles as shown.
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