EDSFF E3 Form Factor

E3 - Enterprise Servers and Storage

E3.S and E3.L size and dimension E3.S and E3.L size and dimension
Type Thickness (mm) Width (mm) Length (mm) Max Power (W)
E3.S 7.5 76 112.75 25
E3.S 2T 16.8 40
E3.L 7.5 142.2
E3.L 2T 16.8 70

PCIe® Lanes per Connector

4, 8, 16, 16+ PCIe lanes per connector diagram

E3 Max Power

E3 SSD rendering with max power values

Engineering Specifications from SNIA

E3 Mechanical/Electrical Specification SFF-TA-1008 A new window will open.
E3 Thermal Characterization Specification SFF-TA-1023 A new window will open.
EDSFF Connector Specification SFF-TA-1002 A new window will open.
EDSFF Connector Pinout (PCIe) SFF-TA-1009 A new window will open.

Engineering Specifications from SNIA

E3 Mechanical/Electrical Specification SFF-TA-1008 A new window will open.
E3 Thermal Characterization Specification SFF-TA-1023 A new window will open.
EDSFF Connector Specification SFF-TA-1002 A new window will open.
EDSFF Connector Pinout (PCIe) SFF-TA-1009 A new window will open.

KIOXIA EDSFF E3 Offerings

KIOXIA CD8P Series

KIOXIA CD8P E3.S SSD product image

KIOXIA CD7 Series

KIOXIA CD7 E3.S SSD product image

KIOXIA CM7 Series

KIOXIA CM7 E3.S SSD product image

KIOXIA CD8P Series

KIOXIA CD7 Series

KIOXIA CD7 E3.S SSD product image

KIOXIA CM7 Series

KIOXIA CM7 E3.S SSD product image
KIOXIA SSD Series Form Factor Endurance Interface Storage Capacity
(GB)
Sequential Read/Write
(MB/s)
Random Read/Write
(IOPS)
EDSFF E3.S Mixed Use
(3 DWPD for 5 years)
PCIe® Gen5 x4, NVMe™ 2.0 1,600
3,200
6,400
12,800
Up to
12,000 / 5,500
Up to
2,000K / 400K
Read Intensive
(1 DWPD for 5 years)
1,920
3,840
7,680
15,360
Up to
2,000K / 200K
Read Intensive
(1 DWPD for 5 years)

Designed to PCIe® Gen5 x4, NVMe™ 1.4
1,920
3,840
7,680
Up to
6,450 / 5,600
Up to
1,050K / 180K
Mixed Use
(3 DWPD for 5 years)

PCIe® Gen5 single x4, dual x2,

NVMe™ 2.0

1,600
3,200
6,400
12,800
Up to
14,000 / 7,000
Up to
2,700K / 600K
Read Intensive
(1 DWPD for 5 years)
1,920
3,840
7,680
15,360
Up to
2,700K / 310K

Companies Offering EDSFF E3.S-enabled Platforms

While E3 form factors began with a focus on traditional enterprise server and storage use cases, hyperscalers are evaluating E3 for use in scale-out environments. Many server, storage and SSD companies with 2.5-inch storage solutions are aligned with the E3 Family. Initial development and demonstration systems in support of the E3 Family of form factors are well underway with early full function development vehicles as shown (Figure 1).

Companies Offering EDSFF E3.S-enabled Platforms

EDSFF E3.S server and storage platforms are becoming available in the market. Here are some E3.S enabled products that are announced or currentlyavailable, as of September 2023.

Learn and Evaluate

  • Product image may represent a design model.
  • PCIe is a registered trademark of PCI-SIG.
  • NVMe is a registered or unregistered mark of NVM Express, Inc. in the United States and other countries.
  • Other company names, product names, and service names may be trademarks of third-party companies.
  • All rights reserved. Information, including product specifications, content of services, and contact information is believed to be accurate as of October, 2023, but is subject to change without prior notice. Technical and application information contained here is subject to the most recent applicable KIOXIA product specifications.